COOL 508 – Liquid Cooling for Electronics

Day One

Introduction

  • Simplified Heat Transfer Algorithms used in Design Procedures
  • Cooling Parallel/Serial Connected Flow Impedances
  • Typical Liquid Coolants
  • Estimating Overall System Flow Impedance

Quiescent System Operation

  • Pump Types and Flow Characteristics
  • Determining Overall System Operating Point
  • Liquid Cooled Heat Sink Design Procedures (Straight, Tubular, Pin Fins)

Day Two

Liquid Coolant Recirculation Loops

  • Air/Liquid Heat Exchanger Design Procedures
  • Closed Liquid-Loop Evaluation, Ambient Cooled
  • Closed Liquid Loop Evaluation, Refrigerant Cooled

Liquid-Cooled System Platforms

  • Converting Air-Cooled Electronic Packages to Liquid Cooling at Minimum Cost
  • Moldline Heat Exchanger Design Procedures
  • Conditioning Enclosures with Re-circulated Liquid Obtained from an Air/Liquid Heat
  • Exchanger

Day Three

Liquid-Loop Discrete Component Flow Impedance

  • Additional Components used in Closed Liquid Loop Systems
  • Quick Disconnect Usage
  • Required Expansion Chamber Volume
  • Plumbing Line Size

Thermal Testing

  • Microchannel Liquid Heat Sink Design Procedures
  • Immersion Cooling
  • Spray Cooling
  • Liquid Boil-off
  • Heat Pipe Technology
  • Problem Solving Workshop “Bring Your Problems”