COOL 520 – Cooling of Electronic Assemblies

Introduction to electronics heat sources

Temperature limits; standards and specifications

Terminology: thermal resistance; convection, radiation, and conduction

Circuit board cooling

  • Conduction cooled boards utilizing ground planes and thermal VIAs
  • Metal core boards, hollow core boards
  • Forced air cooling of printed wiring boards (PWBs)
  • Naturally-cooled printed wiring boards

Forced air cooling of enclosures

  • Determining enclosure air flow requirements
  • Overall flow impedance (pressure drop)
  • Fan/blower operation and overall system performance
  • Acoustical noise considerations
  • Liquid (including spray) cooling of enclosures
  • Air conditioned enclosures (use of refrigeration)

Naturally cooled non-vented enclosures

  • Plastic enclosures
  • EMI may not permit enclosure venting
  • Phase change material (PCM) cooling of enclosures
  • Cooling of solar irradiated enclosures
  • Cooling of portable enclosures

Naturally cooled vented enclosures

  • Buoyancy induced draft cooling
  • Design procedures for short/tall chimney-cooled enclosures
  • Selecting ventilated (perforated) open area
  • Selecting optimum PCB pitch for minimum temperature rise
  • Design example: a 1.0 KW enclosure cooled by buoyancy induced draft

Natural/forced air cooled heat sinks

  • Straight fins vs. pin fins
  • Brazed, extruded and cast heat sinks
  • High altitude performance
  • Radiation cooling effects
  • Micro channel heat sink design

Electronics cooling in vacuum aboard space vehicles

Humidity considerations/Understanding psychometrics

Fundamentals of flow/thermal network modeling

“Rules of thumb” for electronic cooling

Problem solving

Laboratory visit

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