COOL 519 – Cooling Shipboard Electronics

Day One


  • Simplified Heat Transfer/Fluid Flow Algorithms
  • Determining Enclosure Cooling Air Flow Requirements
  • Procedures for determining Pressure Drop (Flow Impedance)
  • Acoustic Considerations, Estimating dBA

Forced Cooled, Vented Enclosures

  • Developing Enclosure Air Flow Circuit
  • Blower/Fan(s) Cooled Enclosure Designs
  • Estimating Overall Enclosure Flow Impedance
  • Enclosure Multiple Internal Flow Paths
  • Blower/Fan(s) Enclosure Placement
  • Enclosure Positive/Negative Internal Pressure Levels
  • Estimating Enclosure Thermal Profiles (Forced Air)

Day Two

Naturally Cooled, Vented Enclosures

  • Buoyancy/Floatation Pressure Rise
  • Evaluating Induced Draft Air Flow
  • Sizing Inlet/Exhaust Air Flow Openings
  • Forced Draft Multiple Flow Paths
  • Estimating Enclosure Thermal Profiles (Naturally Cooled-Vented)

Naturally Cooled, Non-Vented

  • Estimating Enclosure Internal Air Draft Recirculation
  • Spatial Positioning of Internally Mounted Electronic Equipment
  • Determining Effective Enclosure Draft Height
  • Multiple Draft-induced Flow Paths
  • Estimating Enclosure Thermal Profiles (Naturally Cooled-Nonvented)

Day Three

Heat Sink Design

  • Designing Customized Naturally Forced Air Cooled Heat Sinks
  • Heat Sinks Utilizing Straight and Pin Fin Geometries
  • Effects of Heat Sink Attitude
  • Radiation Cooling Effects
  • Liquid Cooled Heat Sinks

Special Topics

  • Micro-channel Heat Sink Design
  • Water Cooled Enclosure Design
  • Air/Liquid Heat Exchanger Design
  • Humidity Considerations/Understanding Psychometrics
  • System Thermal Testing
  • Problem Solving Workshop “Bring Your Problems”